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Our ultra-flat ceramic vacuum wafer chucks, stepper chucks, porous chucks, and electrostatic chucks improve yield management for semiconductor wafer processing. Low-surface-contact configurations minimize the risk of back-side particles for sensitive applications.
Our wafer chucks provide: Ultra-flat capabilities, Mirror polish, Exceptional light weight, High stiffness, Low thermal expansion, F 300 mm diameter and beyond, Extreme wear resistance
CoorsTek electrostatic chucks (ESC) incorporate silica glass for quick chucking and de-chucking of silicon and non-conductive wafer substrates (e.g., sapphire, quartz glass, etc.).
These electrosatic chucks are available with either:
- transparent electrode - inspection chucks for visual inspection of the chucked wafer
- metal electrode - for low out-gassing in high vacuum atmosphere
